Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards

Publisher:
International Electrotechnical Commission - Technical Report

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

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IEC TR 62878-2-7:2019 (E) describes the accelerated stress testing of passive embedded circuit boards. It can be used for screening finished boards, including multilayer and high-density interconnection (HDI) boards. These boards are mainly for mobile devices.

Edition :	1.0
File Size :	1 file , 2.6 MB
Note :	This product is unavailable in Russia, Belarus, Ukraine, Canada
Number of Pages :	12
Published :	03/20/2019

IEC/TR 62878-2-7 Ed. 1.0 en:2019 PDF

Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards

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